HOME / WORKING GROUPS / Co-Packaged Optics
Co-Packaged Optics Working Group
Chairman
Tiger Ninomiya - SENKO Advanced Components
Working Group Members:
3M Company
Accelink Technologies Co., Ltd.
ADVA Optical Networking SE
AIO Core Co., Ltd.
Amphenol Corporation
Applied Optoelectronics Inc
Arista
Broadcom
Celestica Inc.
Ciena Corporation
CommScope Of North Carolina
Cudoform Inc.
Dell Inc.
DuPont Specialty Products USA, LLC
Foxconn Interconnect Technology, Ltd. (FIT)
Fujikura Ltd.
Fujitsu Optical Components
Furukawa Electric
Globalfoundries
Hirose Electric (U.S.A.) Inc.
Hisense Broadband Multimedia Technologies Co., Ltd.
I-PEX Inc.
II-VI Incorporated
Intel Corporation
Juniper Networks
LESSENGERS Inc.
LIPAC Co., Ltd.
Microsoft
NEC Corporation
NVIDIA
Optiwave Systems
Optomind Inc.
Panasonic Corporation Industrial Solutions Company Electromechanical Control Business Division
PETRA
Quanta Computer Inc.
Ragile Networks
RANOVUS
Reichle & De-Massari AG
Rosenberger
Semtech
SENKO Advanced Components
SABIC
Sicoya GmbH
Sumitomo Electric Industries
TTM Technologies Trading (Asia) Co., Ltd.
US Conec Ltd.
Working Group Presentations:
Optics is Easy
Advanced Material Solutions for Co-Packaged Optics
