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Presentations
Challenges and Strategies for high volume
manufacturing and testing of Co-Packaged Optics
Kees Propstra
Vice President of Marketing and General Manager of Quantifi Photonics USA
Co-Packaged Optics (CPO) promise significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.
From one-hour webcast --Kees Propstra, VP of Marketing & GM Quantifi Photonics USA Inc.
Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH
Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH
Paul Yip
Product Marketing Manager
Teruhiko Omori
at Fujikura
New fiber connectivity options inside the switch chassis
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Data Center Front-Panel and Embedded I/O
Data Center Front-Panel and Embedded I/O
Jeffery Maki
Juniper Networks,
Distinguished Engineer II

Introducing OpenLight
Driving The Next Era of Open Silicon Photonics with Integrated Lasers
Tom Mader,
COO, OpenLight

Data Center Front-Panel and Embedded I/O
Yuval Shay
Director of Product
Management & Marketing
Synopsys


Scaling into the Next Decade
MWIS - Multimode Waveguide Interconnect System

Advanced PCBs with Optical Waveguide Interconnects

3M-Rosenberger COBO Webinar


The Evolution of Data Center Networks




Next-Gen Data Center Interconnects:
The Race to 800G
Principal Engineer, Optical System Architecture

Inphi Race to 800G - Next-Gen Data Center
Dr. Radha Nagarajan
Chief Technical Officer
and Senior Vice
President, Platforms


Senior Technical Director, Systems/DSP Architectures

Advanced Material Solutions
for Co-Packaged Optics


R&D Leader, Emerging Technologies, Electronics & Imaging
Thermoplastic Optical Integration
into Co-Packaged Applications
Peter Johnson is a Staff Scientist and SABIC, supporting the development of new chemistries and blends in polyetherimide resins . He obtained his Ph.D in Chemistry at the University of Colorado, Boulder, and has over 10 years of experience in the plastics industry.
For over 20 years, ULTEM™ and EXTEM™ resins from SABIC Specialties have often been specified in the IR transparent optoelectronic interface and fiber optic connectors. Today, demands for vastly increased bandwidth are posing new engineering challenges for the design and production of highly complex, cost effective components within a shrinking connector footprint.
As light coupling optics move from pluggables to on-board or co-packaged designs, new chemistry and materials are expected to meet the changing application environment. The impact to design flexibility, material selection requirements, and assembly steps will be presented, along with potential technology solutions from SABIC Specialties designed to address these challenges.

Peter Johnson
Staff Scientist,
SABIC Specialties

Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics
Optics is a ground field for Alexander, starting in the dot-com era, with his first internship at JDS Uniphase designing AWG for DWDM. He received a B.Eng. degree in engineering physics with mention of excellence from the Ecole Polytechnique de Montreal, with a specialization in numerical simulation for solid state physics and laser matter interaction.
In his computer simulation and imaging master’s degree, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurement. He then worked in speech recognition at Speeckworks with Hidden Markov Model and Neural Networks algorithms.
Joining IBM in 2007, Alexander tackle advanced packaging development within the C2MI research center (www.c2mi.ca) with focus on optoelectronics and semiconductor co-packaging and in 2012, he moved to the silicon nanophotonics team to help lead optical characterization and packaging development.
Alexander Janta-Polczynski
Senior Advanced Packaging Engineer
