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Presentations
 

Exploring Optical Connectors and Fibers
for Next-Gen Switch Fiber Technology

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Inphi Race to 800G - Next-Gen Data Center

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Dr. Radha Nagarajan

Chief Technical Officer
and Senior Vice
President, Platforms

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Dr. Ilya Lyubomirsky

Senior Technical Director, Systems/DSP Architectures

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Thermoplastic Optical Integration
into Co-Packaged Applications

Peter Johnson is a Staff Scientist and SABIC, supporting the development of new chemistries and blends in polyetherimide resins . He obtained his Ph.D in Chemistry at the University of Colorado, Boulder, and has over 10 years of experience in the plastics industry.

 

For over 20 years, ULTEM™ and EXTEM™ resins from SABIC Specialties have often been specified in the IR transparent optoelectronic interface and fiber optic connectors. Today, demands for vastly increased bandwidth are posing new engineering challenges for the design and production of highly complex, cost effective components within a shrinking connector footprint.

 

As light coupling optics move from pluggables to on-board or co-packaged designs, new chemistry and materials are expected to meet the changing application environment.  The impact to design flexibility, material selection requirements, and assembly steps will be presented, along with potential technology solutions from SABIC Specialties designed to address these challenges.

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Peter Johnson
Staff Scientist,
SABIC Specialties

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GLOBALFOUNDRIES
Silicon Photonics

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Vikas Gupta, 
Senior Director of Product
Management and Marketing

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Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics 

Optics is a ground field for Alexander, starting in the dot-com era, with his first internship at JDS Uniphase designing AWG for DWDM.  He received a B.Eng. degree in engineering physics with mention of excellence from the Ecole Polytechnique de Montreal, with a specialization in numerical simulation for solid state physics and laser matter interaction.

 

In his computer simulation and imaging master’s degree, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurement. He then worked in speech recognition at Speeckworks with Hidden Markov Model and Neural Networks algorithms. 

 

Joining IBM in 2007, Alexander tackle advanced packaging development within the C2MI research center (www.c2mi.ca) with focus on optoelectronics and semiconductor co-packaging and in 2012, he moved to the silicon nanophotonics team to help lead optical characterization and packaging development.  

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Alexander Janta-Polczynski
Senior Advanced Packaging Engineer

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