Consortium for On-Board Optics Online Events
Joining forces with GLOBALFOUNDRIES, the company is bringing down the cost of silicon photonics with new technologies such as Reflowable Fiber Assembly, where very dense arrays with optical ports are co-packaged with a processor to achieve avery tight coupling and alignment of the fiber optics.
Join Alexander Janta-Polczynski of IBM and Vikas Gupta of GLOBALFOUNDRIES to review some of the world's leading silicon photonics co-packaging and manufacturing techniques as they discuss parallelized fiber assembly, the compliant polymer interface method, and the future of microelectronic co-packaging design and manufacturing.
Aired August 17, 2020 - In 2016, the groundbreaking book Silicon Photonics: Fueling the Next Information Revolution opened a discussion about how optical technologies would transform datacom and telecom markets.
In the four years since the book was published, many of its predictions have come to pass. Photonic integrated circuits (PICs) are now found throughout the optical transport systems that underpin the Internet and all global communications. And the field continues to evolve at a torrid pace.
In this 40-minute webcast, we hear from authors Roy Rubenstein and Daryl Inniss, moderated by James Carroll. What did they get right in their 2016 work? What did they miss and where is the field headed next? The discussion will cover a range of topics including market dynamics, the competitive landscape, materials science, 400ZR, 800G, co-packaged optics, industry collaboration, and new applications where silicon photonics is having an impact, such as LiDAR, medical imaging, sensors, etc.
How and When Silicon Photonics will Replace Chip to Chip Interconnects
Years ago, we used optocouplers to interface various boards or actuators. These days, we get transceivers capable to cover a 100GbE, 400GbE and beyond in a small mechanical housing. With the increase of data flow for cloud and 5G, the industry is working to reduce cost, power and enhance the capability of the high speed transmission for short or long distances. The efficiency of the CMOS industry using silicon photonics leads to get very small in package optical chiplets around the dice (using 3D structure, multi stacking, TSV). Therefore optical I/Os and digital are converging to offer disruptive architecture for chips but also for system level. Today, we explore the state of the art of Silicon photonics and looking to the future with a debate to understand "When silicon photonics chiplet substitutes copper interfaces at a very large scale beyond datatcom?
Featuring Brad Booth, Microsoft COBO, Dan Berger, GLOBALFOUNDRIES, Seyedi Ashkan, HP, Thomas Liljeberg, Intel, Eric Mounier, Yole Developpement and Vladimir Stojanovic, Ayar Labs
System Evaluation of On-Board Optics Webcast
Aired April 14, 2020 - On-board optical modules have been demonstrated since 2018, and systems using on-board optics were displayed in 2019. The webcast reviews the learnings that have come from designed systems and building networks using onboard optics. Information is shared why these learnings are critical for moving optics forward in the industry; especially as the industry looks toward developments such as terabit optical modules and co-packaged optics.
Beyond 400G - Featuring COBO, EPIC, and Ethernet Alliance
Increasing bandwidth requirements are pushing optical communication technology beyond 400G with faster switches, higher-performance VCSELs, silicon photonics, InP-based PICs, polymer, plasmonics and DML/EMLs will be imperative.