HOME / WORKING GROUPS / MWIS
Multimode Waveguide Interconnect Systems Working Group
Chairman
Joshua Kim - Hirose Electric (U.S.A.) Inc.
For more information please contact:
joshua.kim.6b@hirose-gl.com
-
MWIS at COBO is chartered to create a new standard for optical waveguide-embedded-PCB
to solve the imminent bandwidth and power issues through removing the copper trace. -
Traditional PCB design tool is based on the schematic diagram composed of electrical copper traces and the components, where optical components can be populated and interconnection between optical components are generally implemented by overlay of fibers today.
-
Since MWIS uses embedded optical waveguide instead of fibers which needs to be part of the PCB manufacturing process, there must be some additional steps to utilize the current EDA tools with polymeric film based optical waveguide.
-
MWIS is now seeking EDA vendors contributions for co-developing MWIS design toolbox for
this additional steps.
Multimode Waveguide Interconnect Systems (MWIS) Working Group Members:
3M Company
ADVA Optical Networking SE
AIO Core Co., Ltd.
Amphenol Corporation
Applied Optoelectronics Inc
Arista
Bizlink Technology, Inc.
Broadcom
Celestica Inc.
Ciena Corporation
Cudoform Inc.
Dell Inc.
DuPont Specialty Products USA, LLC
Foxconn Interconnect Technology, Ltd. (FIT)
Fujikura Ltd.
Fujitsu Optical Components
Furukawa Electric
Hirose Electric (U.S.A.) Inc.
Hisense Broadband Multimedia Technologies Co., Ltd.
I-PEX Inc.
Intel Corporation
Juniper Networks
LESSENGERS Inc.
LIPAC Co., Ltd.
Microsoft
NEC Corporation
NVIDIA
Optiwave Systems
Optomind Inc.
Panasonic Corporation Industrial Solutions Company Electromechanical Control Business Division
Panduit
Quanta Computer Inc.
RANOVUS
Reichle & De-Massari AG
Sanmina
Semtech
SENKO Advanced Components
SABIC
Sicoya GmbH
Sumitomo Electric Industries
TTM Technologies Trading (Asia) Co., Ltd.
US Conec Ltd.
Vario-optics AG
Consortium For On-Board Optics