top of page
Challenges and Strategies for high volume manufacturing and testing of Co-Packaged Optics
Co-Packaged Optics (CPO) promise significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.
In this one-hour webcast we will hear from Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH and Kees Propstra, VP of Marketing & GM Quantifi Photonics USA Inc.
COBO Working Groups
Formed to increase bandwidth and reduce power consumption of PCB interconnect systems.
Focused on data center
Working group develops technical guidance and standards co-package optics.
bottom of page